استفاده از حمام های آبکاری مبتنی بر DES
INTRODUCTION
EXPERIMENTAL
RESULTS AND DISCUSSION
CONCLUSION
REFERENCES
INTRODUCTION
Magnetic films are widely used in various electric devices and many fabrication processes, such as sputter depositions, vapor depositions, ion plating, and electroplating. To apply the films to commercial applications, a high deposition rate of the process is an important parameter, and some methods, e.g., pulsed laser deposition, aerosol deposition and arc plasma deposition are well known as high-speed deposition processes. Owing to high economic viabilities and high deposition rates, electroplating is one of the more effective methods to obtain magnetic films. Many studies on electroplated magnetic films have been carried out, and superior soft magnetic properties have been reported. Typical electroplating processes for soft magnetic films employ distilled water as the solvent for electroplating baths. Although aqueous solutions are suitable plating baths, it is difficult to deposit some metals due to decomposition of the water during the plating. Therefore, we recently introduced deep eutectic solvents (DES) for electroplating since many productive advantages of DES have been reported. In our previous studies on soft magnetic films for DES-based plating baths, we found that the textures of electroplated Fe-Ni films dramatically changed depending on the Fe content in the film, confirming the high current efficiency of the plating process (> 90%). Since the current efficiency and the current density during the electroplating are particularly important parameters to obtain a high deposition rate, the obtained high current efficiency for the DES-based baths is attractive for realizing a high deposition rate. In the present study, we focused on another parameter of current density to enhance the deposition rate and investigated the effect of current density on the plating rate, the surface morphology and the magnetic properties of the Fe films.